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JIANGYIN CITY MK ELECTRONICS TECHNOLOGY CO.,LTD
ADDRESS: Jiangyin City, Jiangsu Province, Fan Jing Qian Road 300 Hetang
Mobile: 138 6164 0277
Tell: 086-510-8633 1638
Fax: 086-510-8633 7028
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Website: http://www.mk-km.com
http://www.明康.com
E-mail: mk.ltd@163.com
mk-km@mk-km.com

KM-1(94HB)board

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KM-1(94HB) board

Product Detailed:

 

With the miniaturization of electronic components, the developemnt of high-integrated and high-property automatic assembly machinery and the progress of welding technology, high technology and high-density assembly technology of  automatic machinery have a rapid development.

 

Thus, KM-1 carries out the new punching technology, making the punching temperature low ( 40℃~70℃), to meet the need of times.

 

The process of this produce is that insulating paper, having been bleached and pickled, impregnates with MTO (Modificated Tung Oil) phenolic resin; then covers with Copper Foil; at last, practises Hot Press. It has two categories----double side and single side. It is capable of good electrnic property and poor water absorption. It is designed for electronic equipment, domestic electrical appliances and printed circuit boards in automatic machinery, which is made under thewet and high-frequency  circumstances.

 

Specifications:

 

Model

 KM-1

 ANSI(NEMA)Specification

 XPC

 GB/T 4723-92 Specification

 CPFCP-04

 Dimensions

 1000                              +20                       +20                         +30                       +30
                                      -0          ×1200        -0        、1000         -0         ×1200        -0

 Thickness

 0.5、0.8、1.0、1.2、1.5、1.6、2.0

 

Uses:Computer, tape recorders, remote control devices, electronic toys, telephones, office equipment and other the printed circuit boards in the household appliances.


Technical requirements:The electrical properties of Foil Clad Laminate:

 

 No.

 Index name

 Test Method

 GB/T 4722-92

 The chapter 

 Index

 CPFCP-04

 

 1 

 Copper resistance MΩ not

 more than

 18μm copper foil

 35μm copper foil

 70μm copper foil

 6

 7.0

 3.5

 1.75

 2 

 Surface resistance MΩ is

 not less than

 Steady heat treatment in humid

 box (for choice)

 After recovery of steady heat

 treatment   At 100 ℃

 7

 —

 1000

 30

 3 

 Volume resistivity MΩ·m is

 not less than

 Steady heat treatment in humid

 box (for choice)

 After recovery of steady heat

 treatmentAt 100 ℃

 7

 —

 100

 10 

 4 

 After recovery of wet and heat

 treatment, the permittivity is

 not bigger than

 11

 5.5 

 5 

 After recovery of steady

 wet and heat treatment,

 dielectric loss factor is

 not more than

 11 

 — 

 6 

 Surface corrosion

 8 

 — 

 7 

 Edge corrosion level

 Positive pole does not inferior to

 Negative pole does not inferior to 

 9 

 A/B

 1.6

 

Curvature: The crooked &#118alue of Foil Clad Laminate is tested accoring to GB/T4722 in Chapter 14. When coverting Foil Clad Laminate into L=1000mm, the &#118alue of d and d’ can not exceed the rules of the following table.

 

 Nominal thickness

                                   Crooked &#118alue d

 Single-sided foil covered board                       Double-sided foil covered board

        ≤35μm            >35μm                                 ≤70μm

 Distortion d ’ 

 Single or double foil covered board

 ≤70μ m

 0.8 to 1.2

 upper 1.2 to 1.6

 upper 1.6 to 2.2

 upper 3.2 to 6.4

          39                   74                                        18

          27                   53                                        14

          22                   39                                        11

          19                   28                                         8

 18

 14

 11

  8

 

Other non-electrical properties:

 

 NO.

 Index name

 Test Method 

 GB/T 4722-92

 in the chapter

 Index

 CPFCP-04

 

 1

 Pull-off Strength, N is

 not less than

 15   50
 2

 Peel strength, N / mm is

 not less than

 After welding of 5s

 After drying at 100℃

 After exposuring to 1.1.1-

 trichloroethane solvents

 and steaming After handling the

 stimulated electroplating conditions

 ≥ 35μm copper foil

 18μm copper foil

 16 

 1.0

 1.0

 1.0

 

 —

 3  After Thermal Shock of 10s,  17   Non-hierarchical,non-foaming
 4

 Weldability, s Wet test

 35μm copper foil

 Thickness 0.5mm to 1.6mm

 Thickness more than 6.4mm to 1.6mm

 70μm copper foil

 Semi-wetting test

 20 

 

 

 

 —

 —

 —

 —

 5  Punching &#118alue  18   Hot punching     Cold punching